DWM-RAK4260 Breakout Module

DWM-RAK4260 Breakout Module is specifically designed to allow easy excess to the pins on the module in order to simplify development and testing. The breakout board utilized is of an Xbee form factor and its main purpose is to allow the DWM-RAK4260 stamp module form factor pinout to be transferred to 2.54mm headers. This makes it more convenient for developer to debug their solution.

The module itself has the RAK4260 at its core, which is a module that utilizes the ATSAMR34J18B SIP. This high level of integration allows for outstanding performance: 860nA in sleep mode and LoRa® TX Power of up to 20dBm.

A notable addition to this Breakout module is the ATECC608A Cryptographic co-processor with secure hardware-based key storage. This is what makes this module different (compared to the RAK4200 and RAK4600), adding another level of security in order to future proof your platform.

The module complies with LoRaWAN® 1.0.2 protocols. It also supports Lora® Point to Point communication.

The low power, long range LoRa® communication capabilities of the module make it suitable for a variety of applications in the IoT field such as home automation, sensor networks, building automation, personal area networks applications (health/fitness sensors and monitors, etc.).

Key Features

High-quality Low power LoRa® device (Microchip ATSAMR34J18 SiP)

Fully supported 862 to 1020 MHz frequency coverage (all LoRaWAN® bands)

High level of accuracy and stability (32MHz TXCO)

Max Tx Power: 20dBm

Max Sensitivity (SF12 BW125kHz):  -136dBm

Rx Current: 17mA (typical)

A rich selection of interfaces: I2C, SPI, ADC, UART, GPIOs

Packaging

1pc Board

1pc LoRa® Antenna (with RP-SMA female connector)

24pc Dupont Lines

Useful Link

Quick Start Guide